Iceotope, the global leader in Precision Liquid Cooling, announced the company has achieved chip-level cooling up to and beyond 1000W.
This marks a significant milestone as the data center industry looks to liquid cooling to solve the challenges presented by the compute densities required for AI, the overall rising thermal design power of IT equipment, and the need for sustainable cooling solutions.
In the coming years, it will be critical for data center operators to know they are future-proofing their infrastructure investment for 1000W to 1500W to 2000W CPUs and GPUs. To meet these challenges, Iceotope Labs has demonstrated how Precision Liquid Cooling is expected to meet these challenges through recent testing.
Key findings from the testing include an 11.4% improvement in thermal performance of Precision Liquid Cooling compared to the best tank immersion solutions.This and other results are published in a new white paper: “Achieving chip cooling at 1000W and beyond with single phase Precision Liquid Cooling.”
“Iceotope Precision Liquid Cooling technology has achieved an important industry milestone by demonstrating enhanced thermal performance capability compared to other competing liquid cooling technologies,” said Neil Edmunds, Vice President of Product Management at Iceotope. “We are confident that future testing of our standard solution at elevated power levels will demonstrate further inherent cooling capability. Iceotope are also continuing to develop new solutions which enable even higher roadmap power levels to be attained in a safe, sustainable and scalable way.”
“The ability to cool 1000W silicon is a key milestone in building the runway for silicon with higher thermal design power and enabling efficient data center and Edge cluster solutions of the future,” said Mohan J Kumar, Intel Fellow.
For complete results of the testing, you can download the white paper, “Achieving chip cooling at 1000W and beyond with single phase Precision Liquid Cooling”