Legrand will showcase its new selection of data center infrastructure products during the 2025 Open Compute Project (OCP) Global Summit, underscoring Legrand’s commitment to provide data center operators with greater choice, scalability and speed-to-market through the introduction of new busbar, power shelf and rack solutions.

The new solutions are purpose-built to align with OCP standards, which are becoming increasingly popular thanks to greater end-user interest in deploying artificial intelligence (AI), high-performance computing (HPC) and other cloud-native applications. Data center operators often struggle to find the right hardware to support these advanced technologies. This is pushing them away from Original Equipment Manufacturer-specified solutions and toward OCP standards, the benefits of which include open hardware designs, reduced vendor-lock, greater interchangeability of hardware, improved efficiency and community-driven innovation. This is a growing market with plenty of potential, as the IDC projects the industry to spend over $73.5 billion on OCP-recognized equipment by 2028, up from $41 billion in 2024.

“The rapid growth of AI and other compute-intensive workloads is redefining the data center landscape, and the OCP community is at the forefront of this evolution,” said Calvin Nicholson, Senior Director of Product Management at Legrand. “Both the OCP community and the Legrand team share one common goal – crafting practical, efficient and resilient rack and power infrastructure that empowers data center operators to innovate and deploy on the timelines they need, at scale. That’s why we’re excited to continue expanding into the arena of OCP architecture as a truly comprehensive infrastructure partner.”

Legrand’s OCP ORV3-compliant solutions, expected to be available for sale next year, include a 33kW power shelf with Xerus firmware, vertical DC busbar available in 400, 700 and 1400A, and a rack with capacity up to 5,000 lbs. These solutions are complemented by Legrand’s existing portfolio of power and cooling technologies including track busway, rear door heat exchangers and out-of-band (OOB) serial routers, comprising a truly comprehensive white space solution.

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